截面拋光機
CP-8000+ 是一種先進的樣品預製備處理工具,使用氬離子束切削樣品的橫截面。因為不需要復雜的化學過程,可有效避免樣品的物理變形和結構損壞。該系統可以處理從幾十微米到幾毫米的大面積,簡化了樣品的截面分析。
特點
- 以700 μm/hr高速率切削(基於Si, 8 kV)。
- 可以儲存/加載常用設置。
- 自動執行多階序列步驟。
- 搭配靈巧的樣品載台輕鬆安裝樣品。
- 透過腔體內置鏡頭即時觀察離子束狀態跟切削情況。
- 簡便的操作:直觀的圖形用戶介面和簡單操控的觸控螢幕。
- 對於熱敏樣品可以選擇AUTO BRAM ON / OFF MODE,可依用戶喜好設定離子束強度以及間歇時間,進而最小化樣品的熱破壞。


- 利用腔體內置鏡頭簡單的將離子束對準樣品。
- 使用低噪、低震動的無油泵。
- 表面拋光功能提供大面積的樣品表面拋光或者異物切除。
- 對於多層結構的樣品可以選擇STEP BY STEP MODE,依照各層材料特性分別設定最適合的離子束強度及時間。


CP-8000+ Introduction
https://www.coxem.com/data/file/video/3024111946_Ax8yaKO4_c0f944808075ce95789640beeef14b0b70da689d.mp4
CP-8000+ Operation
https://www.coxem.com/data/file/video/3024111946_BmwSuEdT_964922c115e76b1cbeef2489dd345ef8fcfd70b8.mp4
|
使用的氣體 |
氬氣(Ar) |
|
切削速度 |
700 μm/h(基於矽, 8 kV) |
|
加速電壓 |
2~8kV |
|
離子束直徑 |
約 500 μm |
|
工作壓力 |
4.3 x 10-5 torr |
|
離子束對焦 |
使用數位顯微鏡進行精確離子束對焦 |
|
最大樣品尺寸 |
20(W) x 10(D) x 9(H)mm |
|
樣品移動範圍 |
(Z: ±2mm, Y: ±2mm) |
|
載台擺動角度 |
-35° ~ +35° |
|
表面拋光載台 |
傾斜範圍:40° 至 80° |
|
顯示 |
觸控螢幕(1024 x 600 7 英寸顯示屏) |
|
腔體內置鏡頭 |
放大倍率:x5、x10、x20、x40 |
|
用於樣品對焦的數位鏡頭 |
放大倍率:x5、x10、x20、x40 |
|
真空系統 |
渦輪分子泵(66L/s) |
|
尺寸 |
610(寬) x 472(深) x 415(高)mm |
The CP-8000+ is an advanced sample preparation tool that etches a cross section of a sample using an argon ion beam. This process avoids physical deformation and structural damage, without requiring complicated chemical processes. In addition, the system simplifies cross-sectional analysis of the sample by processing large areas from tens of μm to several mm.
Features
- A high etching rate of 700 μm per hour (based on Si, 8 kV)
- Ability to save/load recipes that are frequently used
- Step by step recipes with automatic execution function
- Easy to load sample using smart sample holder
- Real-time observation of ion beam status and etching status through chamber camera
- Convenient operation - intuitive GUI and easy touch screen
- Minimizes thermal damage with the ion beam Auto On/Off function



- Fast and convenient sample alignment with ion beam using built-in digital microscope
- Provided with noise, vibration, oil-free diaphragm pump
- Flat milling function provided for plane etching of a large areas




CP-8000+ Introduction
https://www.coxem.com/data/file/video/3024111946_Ax8yaKO4_c0f944808075ce95789640beeef14b0b70da689d.mp4
CP-8000+ Operation
https://www.coxem.com/data/file/video/3024111946_BmwSuEdT_964922c115e76b1cbeef2489dd345ef8fcfd70b8.mp4
|
Gas Used |
Ar(Argon) gas |
|
Milling Speed |
700 μm/h (Si at 8kV) |
|
Accelerating Voltage |
2~8 kV |
|
Beam Diameter |
Approx. 500 μm |
|
Working Pressure |
4.3 x 10-5 torr |
|
Beam Alignment |
Precision beam alignment |
|
Maximum Sample Size |
20(W) x 10(D) x 9(H)mm |
|
Sample Moving Range |
(Z: ±2mm, Y: ±2mm) |
|
Stage Swing Rotation |
-35° ~ +35° |
|
Stage for Flat Milling |
Tilt Range : 40° to 80° |
|
Display |
Touch panel (1024 x 600 7 inch display) |
|
Chamber Camera |
Magnification : x5, x10, x20, x40 |
|
Digital Camera for sample alignment |
Magnification : x5, x10, x20, x40 |
|
Evacuation System |
Turbo-molecular pump (66L/s) |
|
Dimension |
610(W) x 472(D) x 415(H)mm |