The thickness of the non-alloyed and alloyed tin layer on thin copper wires can be measured with high accuracy in a short duration by the electrochemical Analyzer SnLayer.
The coulometric determination of the thickness of the tin layer at the copper wires based on a newly developed procedure: the technique of voltammetry with a multiple potential-ramp.
The total amount of tin as well as the non-alloyed and the alloyed tin-part is detectable in only one measurement.
Applications
- Determination of thickness of tin at copper wires
- Determination of the non-alloyed and alloyed tin layer
- Conductor board manufacture
- Wire and cable manufacture
- Quality management in rolling mills
- Application in metal industry
Advantages
- Complete measurement system for the layer thickness of tin
- Differentiation of non-alloyed and alloyed tin
- Fast analysis
- Typical duration: 8 min (non-alloyed and alloyed tin) < 2 min (non-alloyed tin)
- According to the actual standard regulations
- Automatic procedures
- Customer-friendly handling
- Pre-defined methods for selected wire-types
- Generation of individual methods
- Intuitive software
- Comprehensive statistic module
- Wide dynamic range for various wire-diameters and layer thickness
- High precision of the analysis
| Working electrode: | Sample wire |
| Reference electrode: | Ag/AgCl |
| Counter electrode: | Pt |
| Typical duration: | 2 … 8 Min (depending on the sample) |
| Typical wire diameters: | 0.05 … 8 mm |
| Typical layer thickness: | 0.01 … 22 µm |
| Power supply: | 230 V/50 Hz, 115 V/60 Hz |
| Power input: | 150 W |
| Dimensions of control unit: | 370 x 345 x 160 mm (L x D x H) |
| Dimensions of titration unit: | Max. 200 x 300 mm (Ø x H) |
| Weight: | 1 kg |
| Device control: | PC software (PC not included in the scope of delivery) |
