CP-8000+ 是先進的樣品製備工具，可利用氬離子束蝕刻樣品的截面。此製程可避免物理變形與結構破壞，而不需要複雜的化學處理。此外，該系統可處理從數十 um 到數 mm 的大面積，簡化了樣品的截面分析。
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使用氣體 |
氬氣(Argon) |
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銑削速度 |
700 μm/h (Si at 8kV) |
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加速電壓 |
2~8 kV |
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光束直徑 |
約 500 μm |
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工作壓力 |
4.3 x 10-5 torr |
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光束對準 |
使用數位顯微鏡進行精確的光束對準 |
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最大樣品尺寸 |
20(W) x 10(D) x 9(H)mm |
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樣品移動範圍 |
(Z: ±2mm, Y: ±2mm) |
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旋轉角度 |
-35° ~ +35° |
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銑削平台 |
傾斜範圍 : 40° to 80° |
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顯示幕 |
觸控面板 (1024 x 600 ; 7吋 顯示器) |
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腔室相機放大倍率 |
放大倍率 : 5x, 10x, 20x, 40x |
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用於樣品對位的數位相機 |
放大倍率: 5x, 10x, 20x, 40x |
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抽氣系統 |
渦輪分子泵 (66L/s) + 隔膜泵 |
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尺寸 |
610(W) x 472(D) x 415(H)mm |
The CP-8000+ is an advanced sample preparation tool that etches a cross section of a sample using an argon ion beam. This process avoids physical deformation and structural damage, without requiring complicated chemical processes. In addition, the system simplifies cross-sectional analysis of the sample by processing large areas from tens of um to several mm.
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Gas Used |
Ar(Argon) gas (Argon) |
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Milling Speed |
700 μm/h (Si at 8kV) |
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Accelerating Voltage |
2~8 kV |
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Beam Diameter |
Approx. 500 μm |
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Working Pressure |
4.3 x 10-5 torr |
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Beam Alignment Precision beam alignment |
using Digital Microscope |
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Maximum Sample Size |
20(W) x 10(D) x 9(H)mm |
|
Sample Moving Range |
(Z: ±2mm, Y: ±2mm) |
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Rotation |
-35° ~ +35° |
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Stage for Flat Milling |
Tilt Range : 40° to 80° |
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Display |
Touch panel (1024 x 600 7 inch display) |
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Chamber Camera |
Magnification : 5x, 10x, 20x, 40x |
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Digital Camera for sample alignment |
Magnification : 5x, 10x, 20x, 40x |
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Evacuation System |
Turbo-molecular pump (66L/s) |
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Dimension |
610(W) x 472(D) x 415(H)mm |
